tady není o čem moc diskutovat, výhody jsou na straně zdroje dole.

výhody
• Steady supply of cool air from the floor outside the chassis
• Direct expulsion from the case
• Lower fan speed
• Cooler operation allows for greater PSU efficiency
• Less heat stress on the components, longer life-span
• Lower center of gravity
• No hanging power cable
nevýhody
• Chassis must have a bottom opening
• It should also have an air filter
• Possible impact on acoustics, depending on the floor material
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Zdroj nahoře:
výhody
• Helps with cooling in some systems
• Shorter cable necessary for 12 V connections
nevýhody
• Higher PSU temperatures
• Inefficient and loud operation
• System ages faster
http://www.tomshardware.com/reviews/cooling-airflo w-heatsink,3053-4.html